Lista chip ram DDR/DDR2/DDR3

[Chicco85]

Ciao a tutti,

ho trovato questo sito molto interessante. Il database è già abbastanza completo, ma quello che più interessa è la precisione con cui sono riportati i chip (specialmente per le DDR2). Spero vi sia utile:

List of chips used on DDR RAM modules

List of chips used on DDR2 RAM modules

List of chips used on DDR3 RAM modules



Aggiungo anche un altro interessante link, che riguarda solo i chip prodotti da Micron:

DDR2 IC Info (Micron Chips)

Sempre dallo stesso sito, altre cose interessanti:

Various DDR2 ICs

Corsair DDR2 Table

Edit: nuovo database DDR2 con selezione in base ai parametri desiderati

Base de Données DDR2

[brugola.x]

Se possono servire ne ho trovati in giro alcuni da aggiungere:

A-Data
-PC2700 (cl2,5) could be Winbond AH-6 or BH-6
-PC3200 Winbond CH-5, Samsung TCCC
-PC3200 Special Edition Winbond BH-5
-PC3700 (non Vitesta, no HS) should Samsung TCC5
-PC4000 (3-4-4-8 ) Hynix D43, D5, Samsung TCCC
-PC4000 Vitesta (3-4-4-8 ) Hynix D43, D5
-PC4500 Vitesta Samsung TCCD PC4800 Vitesta Hynix B
Apacer
-PC2700 could be Winbond AH-6 Buffalo
-PC3200 may or may not contain Micron 46V32M8 -5B C, 46V32M8 - 5B G look at the chips
-PC3700 may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C look at the chips FireStix
-PC4000 Hynix B
Buffalo
-PC3200 may or may not contain Micron 46V32M8 -5B C, 46V32M8 - 5B G look at the chips
-PC3700 may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C look at the chips
-FireStix PC4000 Hynix B
-FireStix PC3200 CL2 (2-2-2-4) Samsung TCCD
Centon
-Advanced DDR Samsung TCCD
-New Advanced DDR533 (3-4-4-8 ) Hynix D5
-New Advanced DDR400 (2-2-2-5) Samsung TCCD
Corsair
-XMS-PC2700C2 Rev1.1 (2-3-3-6-1T) maybe Winbond BH-6/Samsung TCB3
-XMS-PC2700C2 Rev1.2 (2-3-3-6-1T) Winbond CH-6
-XMS-PC2700C2 Rev1.3 (2-3-3-6-1T) Mosel Vitelic (6ns?)
-XMS-PC2700C2 Rev2.1 (2-3-3-6-1T) Micron (6ns rev B)/Samsung TCB3
-XMS-PC2700LL Rev1.1 (2-2-2-6-1T) Winbond BH-6
-XMS-PC2700LL Rev1.2 (2-2-2-6-1T) Winbond CH-6
-XMS-PC3000C2 Rev1.1 (2-3-3-6-1T) Samsung TCB3/Micron (6ns rev B) and few Winbond BH-6
-XMS-PC3000C2 Rev2.1 (2-3-3-6-1T) should Winbond BH-6
-XMS-PC3200C2 Rev1.0 (2-3-3-6-1T) Winbond CH-5
-XMS-PC3200C2 Rev1.1/2.1 (2-3-3-6-1T) Winbond BH-6
-XMS-PC3200C2 Rev1.2/2.2 (2-3-3-6-1T) Winbond CH-6
-XMS-PC3200C2 Rev3.1 (2-3-3-6-1T) Infineon B-5
-XMS-PC3200C2 Rev4.1 (2-3-3-6-1T) Samsung TCCD
-XMS-PC3200C2 Rev4.2 (2-3-3-6-1T) Samsung TCCD & TCC5
-XMS-PC3200LL Rev1.1/2.1 (2-2-2-6-1T) Winbond BH-5
-XMS-PC3200LL Rev1.2/2.2 (2-3-2-6-1T) Winbond CH-5
-XMS-PC3200LL Rev3.1 (2-3-2-6-1T) Infineon B-5
-XMS-PC3200XL Rev1.1 (2-2-2-5-1T) Samsung TCCD
-XMS-PC3500C2 Rev1.1 (2-3-3-7-1T) Winbond BH-5
-XMS-PC3700 Rev1.1(3-4-4-8-1T) Samsung TCCC
-XMS-PC4000 Rev1.1 (3-4-4-8-1T) Hynix D43
-XMS-PC4400 Rev1.1 (3-4-4-8-1T) Hynix D5
Crucial
-PC3200 may or may not contain Micron 46V32M8 -5B C, 46V32M8 -5B G
-Ballistix PC3200 (2-2-2-8 ) Micron 46V32M8 -5B G (maybe overlabeled)
-Ballistix PC4000 (2.5-4-4-8 ) Micron 46V32M8 -5B G (maybe overlabeled)
GeIL
-Value PC3200 Blue (2.5-3-3-6) Infineon 5ns
-Golden Dragon PC3200 (2-3-3-6-1T) WLCSP chip package (old)
-Ultra Platinum PC3200 (2-3-3-6-1T) Winbond CH-5, Mosel Vitelic 5ns (old)
-Ultra X PC3200 (2-2-2-5-1T) Samsung TCCD
-Ultra X PC4400 (2.5-4-4-8 1T) Samsung TCCD
-Ultra X PC3200 (2-2-2-5-1T) Winbond UTT (BH Series)
-Golden Dragon PC3500 (2.5-3-3-6-1T) WLCSP chip package w/ Samsung chips (old)
-Ultra Platinum PC3500 (2.5-3-3-6-1T) Winbond CH-5, Mosel Vitelic 5ns (old)
-Golden Dragon PC3700 (2.5-4-4-7-1T) WLCSP chip package w/ Samsung chips (old)
-Golden Dragon PC4000 (2.5-4-4-7-1T) WLCSP chip package w/ Samsung chips (old)
-Ultra Platinum PC4000 (3-4-4-8-1T) Hynix D43 (old)
-Ultra Platinum PC4200 (3-4-4-8-1T) Hynix D43 (old)
-Ultra Platinum PC4400 (3-4-4-8-1T) Hynix D5 (old)
-ONE S PC4800 (2.5-4-4-8 1T) Samsung TCCD
-ONE W PC3200 (1.5-2-2-5 1T) Wimbond UTT (BH Series)
-Ultra X PC4000 (2.5-3-3-5 or 2.5-4-4-8 1T) New Samsung UCCD

G.Skill
G.SKILL PC3200(DDR400 1T) (2-2-2-5 1T), (F1-3200BWU2-512MBGH/1GBGH) Winbond UTT
G.SKILL PC4800(DDR600 1T) (2.5-4-4- 8 1T), PC3200 (2-2-2-5), (F1-3200DSU2-512FF/1GBFF) Samsung TCCD (new production)
G.SKILL PC4400(DDR550) (2.5-4-4-8 ), PC3200 (2-2-2-5) 1GB Kit (F1-3200DSU2-512LC/1GBLC) Samsung TCCD
G.SKILL PC4400(DDR550) (2.5-3-3-7), PC3200 (2-2-2-5) 512M Kit (F1-3200DSU2-512LE/1GBLE) Samsung TCCD (new production)
G.SKILL PC4800(DDR600) (2.5-4-4-8 ), PC3200 (2-2-2-5) (F1-3200DSU2-512LA/1GBLA) Samsung TCCD (new production)
G.SKILL PC4400(DDR550) (2.5-4-4-8 ), PC3200 (2-3-3-6) (F1-3200DSU2-512LD/1GBLD) Samsung TCCD
Kingmax
DDR PC2700 (2.5) TinyBGA
DDR PC3200 (2.5) TinyBGA
Hardcore PC4000 TSOP (3-4-4-8-1T) --chip--> Hynix D5
Kingston
-HyperX PC2700 (2-2-2-5-1T) (KHX 2700) first Samsung TCB3, then Winbond BH-6, CH-6, CH-5, relabeled unknown Chips.
-HyperX PC3000 (2-2-2-6-1T) (KHX 3000) first Samsung TCB3, then mainly Winbond BH-5, some BH-6, CH-5, CH-6 (maybe relabeled)
-HyperX PC 3200 (old revision, not AK2, K2 or A) (KHX 3200) Winbond BH-5
-HyperX PC 3200K2 (2-2-2-6-1T) (KHX 3200K2) Winbond BH-5
-HyperX PC 3200AK2 (2-3-2-6-1T) (KHX 3200AK2) Winbond CH-5
-HyperX PC 3200ULK2 (2-2-2-5-1T) (KHX 3200ULK2) Samsung TCCD
-HyperX PC 3500 (rated 2-3-3-7 @ 433Mhz, 2-2-2-6 @ 400Mhz, old revision) (KHX 3500) Winbond BH-5 (maybe relabeled)
-HyperX PC 3500K2 (2-3-3-7) (KHX 3500K2) Winbond CH-5
-HyperX PC 4000K2 (3-4-4-8 ) (KHX 4000K2) Samsung TCCC, Hynix D43, D5
-HyperX PC 4300K2 (3-4-4-8 ) (KHX 4300K2) Hynix D5
-Kingston Ram w/remarked Chips as D328DW-45 Before Week 18 Year 03 Winbond BH-5, after CH-5 (18 03 can be both)
-Kingston Ram w/remarked Chips as D328DW-5 Winbond BH-5
-Kingston Ram w/remarked Chips as D328DW-6 Winbond BH-6
-Kingston Ram w/remarked Chips as D328DM-6 should Winbond BH-6
-Kingston Ram w/remarked Chips as D328DM-5 should Winbond BH-5
-Value Ram 333Mhz (2,5-3-3-*) (KVR333X64C25) may or may not contain Winbond BH-6, AH-6, Hynix D43, D5 look at the chips (maybe relabeled)
-Value Ram 400Mhz (2,5-3-3-*) (KVR400X64C25) may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C, Hynix D43, D5, Samsung TCCC, TCC4 look at the chips (maybe relabeled)
Mushkin
-PC2700 (Non Level X, rated 2-3-3, Promo-Build) Winbond CH-6
-PC3200 Cl2,5 (Non Level X, non Blue, non Green Serie) Winbond BH-5, Samsung TCB3
-PC3200 (Non Level X, rated 2-2-2, Promo-Build) Winbond BH-5
-PC3200 Level I (2-3-2) Winbond CH-5
-PC3200 Level II (2-2-2) Winbond BH-5 or BH-6
-PC3200 Special 2-2-2 Winbond BH-6
-PC3200 Level II V2 (2-2-2) Samsung TCCD
-PC3200 BLUE CL2 (2-3-3-X) Winbond UTT
-PC3500 Level I (2-3-3) Winbond CH-5
-PC3500 Level II (2-2-2) Winbond BH-5
OCZ
-EL DDR PC3200 Platinum Limited Edition (2-2-2-7) Winbond BH-6
-EL DDR PC3200 Platinum Edition (2-3-2-5) Samsung TCB3, ProMOS 5ns (relabeled), Mosel Vitelic 5ns (relabeled), Winbond CH-5
-EL DDR PC3200 Platinum Edition (2-3-2-5) OCZ4001024ELDCPE-K Infineon
-EB DDR PC3200 Platinum Edition (2,5-3-2-8 ) Micron 46V32M8 -5B C
-EL DDR PC3200 Platinum Edition rev2 (2-2-2-6) Samsung 4ns TCCD
-EL DDR PC3500 Platinum Limited Edition (2-2-3-6) Winbond BH-5
-EL DDR PC3500 Platinum Edition (2-3-2-5) Winbond CH-5, few BH-5
-EB DDR PC3500 Platinum Edition (2,5-3-2-8 ) Micron 46V32M8 -5B C
-EL DDR PC3700 Gold Edition rev1 (2-3-3-7) Samsung TCB3 (overlabeled)
-EL DDR PC3700 Gold Edition rev2 (2,5-3-3-7) ProMOS 5ns (relabeled) , Mosel Vitelic 5ns (relabeled)
-EB DDR PC3700 Platinum Edition (3-2-2-8/3-3-2-8 ) Micron 46V32M8 -5B C
-DDR PC4000 (3-4-4-8 ) Hynix D5, D43 (relabeled)
-DDR PC4200 (3-4-4-8 ) Hynix D5, D43
-DDR PC4400 (3-4-4-8 ) Hynix D5 EL
-DDR PC4400 Gold Edition (2,5-4-4-8 ) Hynix B
-EL DDR PC4400 Gold Edition (2,5-4-4-8 ) Hynix B, Samsung TCCD
-EL PC4800 Platinum Edition (2,5-4-4-10 1T/2T) Samsung TCCD (new )
Samsung
-PC3200 Samsung TCC4, TCCC
-PC3700 Samsung TCC5
-PC4000 CL3 Samsung TCCD
Shikatronics
-ShikaXram PC4400 (3-4-4-8 ) Hynix B
TeamGroup
XTREEMSERIES
-PC3200 2x512 UTT/BH5 1.5.2.2.5/2.2.2.5/2.5.4.4.8 (not imported in italy)
-PC4000 2x512 Samsung TCCD 2.5-3-3-5
-PC4400 2x512 Samsung TCCD 2.5-4-3-7
-PC4800 2x512 Samsung TCCD 2.5-4-4-8
-PC3200 2x1GB Infineon 2.5-4-4-8
-PC3200 2x1GB Infineon 2-3-2-5
-PC4000 2x1GB Samsung UCCD 2.5-4-4-8/3.4.4.8
-PC4000 2x1GB Micron IC 3.3.3.8
TwinMos
-Twinmos DDR333 (2,5-3-3-6) Samsung TCB3, TCC4 Winbond AH-6, Winbond BH-6, Twinmos, Hynix, Mtec
-Twinmos/Winbond DDR400 (2,5-3-3-6) Could be Winbond BH-5, CH-5, look at the chips
-Twinmos Twisters DDR500 (TSOP) (3-4-4-8 ) Hynix D43, Samsung TCCC
-Twinmos Twisters DDR533 (3-4-4-8 ) Hynix D5
-TwisterPro PC3700/DDR466 (2,5-3-3-7) Samsung TCCD
-Speed Premium PC3500 (DDR433) (2,5-3-3-8 ) Winbond New BH-5
Ultra

[giampa]

grazie per la segnalazione, dò una controllata...

[Chicco85]

Grazie mille...

P.s.: li hai presi da XS o da HwUpgrade? C'è qualche errorino o meglio, incompletezza. Le vitesta pc4800 non solo montavano Hynix B , ma anche TCCD ad esempio.

[brugola.x]

Le ho trovate sul forum di PC Tuner in overclock.......

[Chicco85]

Nel primo topic ho aggiunto un altro database per DDR2 (Base de Données DDR2), con funzione di selezione in base a numerosi parametri.

[Chicco85]

Ora c'è anche un database per le memorie DDR3 più altri link utili.

[brugola.x]

ho scovato questa "tabellina" per i chip Micron



ecco il link The interactive memory product ID guide

fonte OverClocked inside home page

[Elron]

Nel primo topic ho aggiunto un altro database per DDR2 (Base de Données DDR2), con funzione di selezione in base a numerosi parametri.

Magari mi sbaglio, ma sembra abbiano rimosso la suddetta pagina... o non funziona solo a me?!?!?!

[MaxWrt]

ad oggi posso dire...
Tutte le ocz montano chip samsung hcf0 ad eccezione delle reaper 1333 che dovrebbero ancora avere i gtn infatti le platinium eb non sono piu 7-6-6 ma sono 7-7-6 e quindi montano i samsung mi sono messo in contatto con drako e mi ha fornito per telefono queste info informandosi da ocz.. nessuna e ripeto nessuna ram ocz per il momento monta piu i micron ne moduli 2x1 ne moduli 2x2.

G.Skill 12800 hz\pi.. anch'esse sono samsung hcf0 e da quanto ho visto di persona sia sui miei moduli che su extreme systems non sono mandate che finiranno ma li montano da una certa settimana di produzione... e credo che non cambiano per adesso.. stara finendo l'era micron? speriamo di no! sicuramente sara' dovuto al costo eccessivo dei micron rispetto ai samsung il motivo del cambiamento da parte di molti costruttori..